19 April 2020
Youssef Hamid (Cohort 3) attended the 21st Electronic Packaging Technology Conference (EPTC 2019) held in Singapore from the 4th to 6th December 2019.
This is a major conference of the Asian chapter of the IEEE Electronics Packaging Society (EPS). With several academics, engineers, researcher gathering, the event was important networking opportunity focused on the specific areas of MEMS packaging, Microelectronic manufacturing and homogeneous integration.
During this event, Youssef presented his second conference paper on “Packaging Effects on MEMS Pressure Sensor Hysteresis”. This had led to further conversations with Prof Chris Baily from Greenwich University, Dr Karsten Meier from Dresden University, Germany about the use of ANSYS as a simulation tool for MEMS packaging.
Throughout the 3 conference days, Youssef learned about using Raman spectroscopy to measure stress in Silicon MEMS devices as a means for evaluation residual packaging effects from Pf Xuejun Fan from Lamar University, USA; a technique present at Loughborough university a was investigate during the research project. Interesting conversation with STMicroelectronics engineer Dr Roseanna Duca revolving packaging techniques for microphones also occurred.
EPTC was the second international opportunity to present to MEMS packaging experts.