- Matching packaging technologies to volume demand, ensuring cost, quality and resilience for all levels of packaging – chip, system-on-chip (insert), module level (e.g. wirebonds, flip chip), chassis to chassis (cable, flex or wireless);
Design of antennae structures and dielectric builds for robust wireless communications;
- Matching design partitioning of functionality onto components / chipsets selection and packages for cost, size and compatibility;
Low-cost integration of packaging solutions with current manufacturing processes, e.g. placement and interconnection of chips within PCB during fabrication requires assembly and joining processes not normally found at a PCB fabricators facility;
- Determining assembly methodologies compatible with the surrounding product matrix for interconnections that will need to be robust to withstand any subsequent processes.
- High yields at all stages since encapsulation (e.g. overmoulding, ultrasonic lamination) or sealing within an enclosure can lead to difficulty in reworking;
- Reliability and resilience of packaging and interconnection solutions for the end-use lifetime.
- Development of advanced packaging at wafer level and for 3D interconnects, which is critical for enabling higher integration, new design freedoms, smaller device footprint, lighter products, reduced signal inductance and higher I/O density;
- Materials for thermal matching, novel materials, Cu vs Ag (i.e resource efficiency).
packaging & integration
Packaging and integration is concerned with the choice of materials, encapsulation, technologies, components and their limitations and how they integrate with one another to ensure system level performance.
PhD projects with a focus in this area include:
- Joe Holt, co-sponsored by Far UK "Design and Manufacture of Functionally-tailored Multimaterial Structures with Embedded Intelligence"
- Adam Kaye co-sponsored by Printed Electronics Ltd "Ink-Jet Printing Antennas on 3D Curved Surfaces"
- David Czerski co-sponsored by Renishaw "Remote sensing and positioning by using Galfenol on remotely powered surface wave acoustic devices"
- Tobias Reichold co-sponsored by Renishaw "High-speed micro 3D metrology"