Sensors and Electronic Instrumentation Advances Conference
10 February 2020
Youssef Hamid (Cohort 3) attended the 5th annual conference on Sensors and Electronic Instrumentation Advances (SEIA' 2019) held in Tenerife, Spain from the 25th to 27th Sep 2019.
With several scientists and engineers brought together, the event was a great networking opportunity focused on the specific areas of sensor development, MEMS actuators and measurements.
During this event, Youssef presented his first ever abstract on the “effect of thin film interconnect inelasticity on MEMS pressure sensor hysteresis”, a topic that sparked real interest amongst attendee’s Dr Eleanor Chalkley from Strathclyde, UK, and Dr Dan Stefanescu from the Romanian Measurement Society, Romania.
Throughout conversations with other attendees, Youssef learned about using platinum strips as insitu temperature sensors due their constant temperature coefficient of resistance throughout an extended range. Presenting at the SEIA conference represented an excellent communication exercise building on the university approved Vitae RDF training program which helped meet and network with expert MEMS sensors.
