Packaging and integration is concerned with the choice of materials, encapsulation, technologies, components and their limitations and how they integrate with one another to ensure system level performance.

PhD projects with a focus in this area include:

  • Joe Holt, co-sponsored by Far UK "Design and Manufacture of Functionally-tailored Multimaterial Structures with Embedded Intelligence"
  • Adam Kaye co-sponsored by Printed Electronics Ltd "Ink-Jet Printing Antennas on 3D Curved Surfaces"
  • David Czerski co-sponsored by Renishaw "Remote sensing and positioning by using Galfenol on remotely powered surface wave acoustic devices"
  • Tobias Reichold co-sponsored by Renishaw "High-speed micro 3D metrology"
Programme Group Projects 800

general enquiries contact

Loughborough University
Wolfson School
Loughborough University
Loughborough, Leicestershire
LE11 3TU
United Kingdom